Suitable for grinding Sapphire, zinc selenide, zinc sulfide, polycrystalline silicon, monocrystalline silicon, precious
Introduction:
Special type Diamond powder is the use of high-quality single Crystal Diamond Diamond CSD series of raw materials, precision production and processing technology, crushing, shaping, purification, special acid treatment, grading and other processes processed.Mainly used in the production of PCD tool with composite sheet, PDC field with composite sheet, Diamond wafer, Diamond die core, TSP and Diamond wire saws.
CSDM -WS
Features: high strength CSD series of diamond as raw material, the use of advanced production and processing technology, the crushing, shaping, purification, grading and other processes processed products pale yellow, crystalline rules, was close to the equal volume oval-shaped particles, particle size concentration and uniformity, low impurity content, wear resistance, good dispersion.
Uses: suitable for the production of diamond wire saw or other diamond cutting tools for cutting Sapphire, polycrystalline silicon, Monocrystalline silicon, precious stones, quartz plates, LED display, liquid crystal glass, magnetic materials, Semiconductors and other valuable and fragile high-tech materials.
Specification table:
|
Grade
Size
|
ACM |
CSDM-D |
CSDM-C |
CSDM-B |
CSDM-A |
| 0-0.05 |
|
|
Y |
Y |
Y |
| 0-0.1 |
|
|
Y |
Y |
Y |
| 0-0.125 |
|
|
Y |
Y |
Y |
| 0-0.2 |
|
Y |
Y |
Y |
Y |
| 0-0.25 |
|
Y |
Y |
Y |
Y |
| 0-0.5 |
Y |
Y |
Y |
Y |
Y |
| 0-1 |
Y |
Y |
Y |
Y |
Y |
| 0-2 |
Y |
Y |
Y |
Y |
Y |
| 1-2 |
Y |
Y |
Y |
Y |
Y |
| 1-3 |
Y |
Y |
Y |
Y |
Y |
| 2-3 |
Y |
Y |
Y |
Y |
Y |
| 2-4 |
Y |
Y |
Y |
Y |
Y |
| 2-5 |
Y |
Y |
Y |
Y |
Y |
| 3-5 |
Y |
Y |
Y |
Y |
Y |
| 4-6 |
Y |
Y |
Y |
Y |
Y |
| 4-8 |
Y |
Y |
Y |
Y |
Y |
| 5-7 |
Y |
Y |
Y |
Y |
Y |
| 5-10 |
Y |
Y |
Y |
Y |
Y |
| 6-12 |
Y |
Y |
Y |
Y |
Y |
| 7-10 |
Y |
Y |
Y |
Y |
Y |
| 8-12 |
Y |
Y |
Y |
Y |
Y |
| 8-16 |
Y |
Y |
Y |
Y |
Y |
| 10-14 |
Y |
Y |
Y |
Y |
Y |
| 10-20 |
Y |
Y |
Y |
Y |
Y |
| 14-20 |
Y |
Y |
Y |
Y |
Y |
| 12-22 |
Y |
Y |
Y |
Y |
Y |
| 15-25 |
Y |
Y |
Y |
Y |
Y |
| 20-28 |
Y |
Y |
Y |
Y |
Y |
| 20-30 |
Y |
Y |
Y |
Y |
Y |
| 22-36 |
Y |
Y |
Y |
Y |
Y |
| 20-40 |
Y |
Y |
Y |
Y |
Y |
| 28-40 |
Y |
Y |
Y |
Y |
Y |
| 30-40 |
Y |
Y |
Y |
Y |
Y |
| 40-50 |
Y |
Y |
Y |
Y |
Y |
| 40-60 |
Y |
Y |
Y |
Y |
Y |
| 50-60 |
Y |
Y |
Y |
Y |
Y |
Comparison table:
| Chinese standards |
International standards |
Japanese standards/number of entries(#) |
Russia
GOST9206-80
|
Median D50 (μｍ) |
| w0.2 |
0-0.2 |
80000 |
|
0.1 |
| w0.25 |
0-0.25 |
60000 |
|
0.11～0.20 |
| w0.5 |
0-0.5 |
30000 |
0.5/0 |
0.20～0.30 |
| w1 |
0-1 |
15000 |
1/0 |
0.6～0.8 |
| w1.5- |
0-2 |
13000 |
|
0.8～1.0 |
| w1.5 |
1-2 |
12000 |
2/1 |
1.1～1.3 |
| w2.5 |
1-3 |
10000 |
|
1.6～1.8 |
| W3 |
2-3 |
7000 |
3/2 |
1.9～2.1 |
| w3.5 |
2-4 |
6000 |
|
2.6～3.0 |
| W5- |
2-5 |
5000 |
5/3 |
3.1～3.4 |
| w5 |
3-6 |
4000 |
|
3.5～4.2 |
| W5+ |
4-6 |
3500 |
|
4.4～5.0 |
| w7 |
4-8 |
3000 |
7/5 |
5.0～6.0 |
| W7+ |
4-9 |
2500 |
|
6.1～6.5 |
| w10- |
5-10 |
2000 |
10/7 |
6.5～7.3 |
| w10 |
6-12 |
1800 |
|
7.3～8.3 |
| w10+ |
8-12 |
1600 |
|
8.3～9.0 |
| w14- |
7-14 |
1500 |
|
9.1～10.5 |
| w14 |
8-16 |
1300 |
14/10 |
10.0～12.0 |
| w20- |
10-20 |
1200 |
|
12.5～15.0 |
| w20 |
12-22 |
1000 |
20/14 |
15.0～17.0 |
| w20+ |
15-25 |
800 |
|
18.0～20.0 |
| w28 |
20-30 |
700 |
28/20 |
20～23 |
| w28+ |
22-36 |
600 |
|
23～26 |
| w40- |
20-40 |
500 |
|
26～29 |
| w40 |
30-40 |
450 |
40/28 |
29～32 |
| w40+ |
35-45 |
400 |
|
32～36 |
| w50 |
40-60 |
350 |
60/40 |
37～43 |
Product Tags:
|
|
High Strength Diamond Abrasive Powder For Grinding Sapphire / Polycrystalline Silicon Images
|
